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Japan; specific worksite, salary, employment terms, start date and relocation/visa support must be confirmed for the assignment.
Device physics · Characterization · SPICE · Reliability
Responsibilities
- Perform device characterization and testing, SPICE modeling and reliability analysis.
- Evaluate device behavior under high-temperature automotive conditions.
Requirements
- A foundation in semiconductor device physics.
- Experience in device testing, modeling or reliability.
- Bachelor’s degree in semiconductors, electronics or a related field.
- Working proficiency in English OR Japanese; both are not required by this brief.
- Relevant hands-on experience and willingness to work on-site in Japan long term.